You will be a highly skilled and experienced operational engineering in semiconductor industry (FE to BE). As an AI senior manager operations engineering, you will play a crucial role in managing roadmap OSATs for critical KPI (i.e. yield, quality, OEE% etc.…), driving continuous improvement and optimization for nonstandard package processes and collaborating with multi-function teams to support and drive AI product ramp/ releasing in aggressive lead time. This position requires a strong background in semiconductor engineering (including tradition standard BE process in Assy/ Test and FE knowledge is a plus), extensive hands-on experience and high flexibility of traveling/ onsite supporting.

Your Role

Key responsibilities in your new role

• Be a crucial part in optimizing non-standard package processes, collaborating with cross-functional teams, and supporting the rapid ramp-up and release of AI products.
• Develop and execute strategic plans to achieve operational excellence in OSAT operations.
• Be responsible for driving the development and implementation of roadmaps for Outsourced Semiconductor Assembly and Test (OSAT) operations, with a focus on key performance indicators (KPIs) such as yield, quality, and overall equipment effectiveness (OEE).
• Collaborate with multi-functional teams to support AI product development and launch
• Provide technical leadership and guidance to ensure successful product ramp-up and continuous sustaining/ improving for mass production
  
  

Your Profile

Qualifications And Skills To Help You Succeed

• 10+ years' experiences in at least BE assembly process and test engineering with good quality management/ mindset in semiconductor backend or substrate manufacturing industry,
• Strong knowledge and patience to deal with production sustaining, process development/ optimization and yield improvement
• Strong data analysis and problem-solving skills. (Spotfire, JMP and etc. software in middle to expert level skills is required)
• Good understanding of VDA6.3, IATF16949, APQP, FMEA, DOE, SPC, 8D and other QC tools
• Good communication skills, willing and able to work in multi-function environment to provide hands on result with considering win-win result oriented outcomes
• External manufacturing management skillsets to provide effectives management skill on OSAT management and communication to drive efficient actions in short lead time
• Good learning curve and curiosity, always keep in fresh eye to drive continuous improvement and take new challenges/ knowledge as opportunities to drive for improvement
• Willing to do high frequency on-site traveling (>70% on-site per year is required)
• Chip Embedded package experiences is a plus
• Degrees in Electronic Engineering, Mechanical Engineering, Material or Chemical Science preferred
  
  

Contact:

lucy.shi@infineon.cn

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.

We look forward to receiving your resume, even if you do not entirely meet all the requirements of the job posting.

Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.

Click here for more information about Diversity & Inclusion at Infineon.